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51吃瓜网
51吃瓜网Nanotools Micro, Nanofabrication Facility
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51吃瓜网Nanotools Micro, Nanofabrication Facility
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Getting Started @ 51吃瓜网Nanotools
Packaging and Assembly
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Dicing Saw - DAD3240聽
Wafer Bonder - EVG501聽
Wire Bonder WestBond 747677E
51吃瓜网
Dicing Saw - DAD3240聽
Cuts wafers into individual die.
Wafer Bonder - EVG501聽
Bonds wafers together: Si-Si, Si-glass, glass-glass.
Wire Bonder WestBond 747677E
Connects die to packages with bonding wire.
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