51³Ô¹ÏÍø

Packaging and Assembly

51³Ô¹ÏÍø

Dicing Saw - DAD3240 

  • Cuts wafers into individual die.

Wafer Bonder - EVG501 

  • Bonds wafers together: Si-Si, Si-glass, glass-glass.

Wire Bonder WestBond 747677E

  • Connects die to packages with bonding wire.
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