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UID:20250629T143350EDT-9892tWX4x0@132.216.98.100
DTSTAMP:20250629T183350Z
DESCRIPTION:L’Atelier scientifique sur les composants et microsystèmes: évo
 lution des techniques de packaging et d’interconnexion.  The ISS Program w
 ould like to announce a special 1-day workshop on Device Packaging to be p
 resented Wednesday January 30\, 2013 in collaboration with Le laboratoire 
 Nanotechnologies Nanosystèmes (LN2)\, Le Centre de Collaboration MiQro Inn
 ovation (C2MI) and NanoQuébec.  “L’Atelier scientifique sur les composants
  et microsystèmes: évolution des techniques de packaging et d’interconnexi
 on” will be presented at the C2MI in Bromont\, QC from 8:30 am to 6:00pm. 
  Registration and sign up for transport from 51�Թ��� (downtown M
 ontreal) to C2MI can be found at www.mcgill.ca/miam/iss/courses/packaging.
   Space is limited\; please sign up now to reserve your space.
DTSTART;VALUE=DATE:20130130
DTEND;VALUE=DATE:20130130
SUMMARY:Packaging Workshop 
URL:/miam/Packaging
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